AMD’s EPYC Genoa-X Processors To Include 3D V-Cache for Speed and Efficiency

The next Genoa-X central processing units (CPUs) from AMD, which will have the new Zen 4 core along with 3D V-cache incorporated into server solutions, are scheduled to provide the EPYC range a boost in the near future. The specifications for the two SKUs, “100-000000892-04” and “100-000000892-06,” have been leaked, and they reveal that they will deliver high-end performance. These central processing units will each contain 12 Zen 4 CCDs and a single I/O die in their respective configurations. In addition to this, every single one of the Zen 4 CCDs will include a 3D V-cache stack that has the potential to store up to 64 MB of L3 cache.

The EPYC Genoa-X central processing units will have a total cache capacity of 1248 MB. This will be broken down as follows: 384 MB of L3 cache will come from CCDs, 768 MB of L3 cache will come from 3D V-Cache stacks, and 96 MB of L2 cache will be provided. In terms of the specifications, the end product will be a total of 1248 megabytes (MB). The maximum boost frequency of these central processor units is 3.7 GHz, and their thermal design power (TDP) can range anywhere from 320 to 400 watts.

It is anticipated that EPYC Genoa-X central processing units would become available on the market in the middle of 2023. The EPYC 9684X will be the most powerful chip, featuring the maximum number of 96 cores and 1152 MB of L3 cache. Additional models include the EPYC 9384X, which comes with 32 cores, the EPYC 9284X, which comes with 24, and the EPYC 9184X, which comes with 16 cores. Along the same lines as the last generation of 3D V-Cache EPYC CPUs, these chips will be geared towards applications that can benefit from cache optimization. EPYC Genoa-X CPUs can be easily integrated with existing products from OEM thanks to their compatibility for the same SP5 architecture. This makes them a versatile and efficient alternative for servers.